HONEYWELL 51404305-275電阻模塊,51404305-275使用方法教程
支持?jǐn)U展和遠(yuǎn)程基板，因此25針D型內(nèi)螺紋膨脹接頭位于基板的右端，用于連接到擴(kuò)展或遠(yuǎn)程基板。由于CPU是模塊化的，因此可以在以下情況下更換或更改為其他類型：需要其他功能。每個(gè)系統(tǒng)只允許一個(gè)CPU基板。如果不止一個(gè)基板在系統(tǒng)中使用，附加的必須是擴(kuò)展的或遠(yuǎn)程的類型。默認(rèn)情況下，模塊化CPU基板的機(jī)架號(hào)始終為0。電纜總長(zhǎng)度不得超過(guò)50英尺（15米）互連擴(kuò)展基板和CPU基板。膨脹基板不能單獨(dú)存在。
HONEYWELL 51404305-275電阻模塊它必須連接到具有CPU的系統(tǒng)。CPU可以位于PLC或個(gè)人計(jì)算機(jī)中配備個(gè)人計(jì)算機(jī)接口卡（見(jiàn)第11章）。每個(gè)系統(tǒng)允許的最大膨脹基板數(shù)量取決于與它們一起使用的CPU類型。對(duì)于CPU 331、340和341最大值為4。對(duì)于編號(hào)為350或更高的CPU，最大值為7。每個(gè)擴(kuò)展基板有一個(gè)25針內(nèi)螺紋D型輸入/輸出總線擴(kuò)展連接器安裝在其右端，用于連接到其他基板。有兩種版本；5插槽（IC693CHS398）和10插槽（IC693CHS392）擴(kuò)展背板不支持以下智能選項(xiàng)模塊：PCM、ADC、BEM330和CMM。必須安裝這些模塊在CPU基板中。所有其他輸入/輸出和選項(xiàng)模塊可以安裝在任何機(jī)架類型。所有膨脹基板必須連接到公共接地（參見(jiàn)“安裝”章節(jié)了解詳細(xì)信息）。膨脹基板的物理尺寸相同，使用相同類型的電源提供并支持與遠(yuǎn)程設(shè)備相同的輸入/輸出和選項(xiàng)模塊基板。
每個(gè)擴(kuò)展基板都有一個(gè)機(jī)架編號(hào)選擇DIP開關(guān)。
There can be no more than a total of 50 feet (15 meters) of cable
interconnecting Expansion baseplates and the CPU baseplate.
An Expansion baseplate cannot stand alone. It must be connected to a
system that has a CPU. The CPU can be in a PLC or in a Personal Computer
that is equipped with a Personal Computer Interface Card (see Chapter 11).
Maximum number of Expansion baseplates allowed per system depends on
the type of CPU they are used with. For CPUs 331, 340, and 341, the
maximum is 4. For CPUs numbered 350 and higher, the maximum is 7.
Each Expansion baseplate has a 25-pin female D-type I/O Bus Expansion
connector mounted at its right end for connection to other baseplates.
Available in two versions; 5-slot (IC693CHS398) and 10-slot (IC693CHS392)
An Expansion backplane does not support the following intelligent option
modules: PCM, ADC, BEM330, and CMM. These modules must be mounted
in a CPU baseplate. All other I/O and option modules can be mounted in any
type of rack.
All Expansion baseplates must be connected to a common ground (see the
“Installation” chapter for details).
Expansion baseplates are the same physical size, use the same type power
supplies, and support the same I/O and option modules as the Remote
baseplates.
Each Expansion baseplate has a Rack Number Selection DIP switch.
