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Brooks BM23100L03/E PC23100微型處理器模塊

Brooks BM23100L03/E PC23100微型處理器模塊

Brooks BM23100L03/E PC23100微型處理器模塊 PDF資料1.產(chǎn) 品 資 料 介 紹:中文資料:Brooks BM23100L03/E 和 PC23100 微型處理器模塊是專為自動(dòng)化系統(tǒng)和機(jī)器人應(yīng)用設(shè)計(jì)的模塊,提供高效的數(shù)據(jù)處理能力和系統(tǒng)控制功能,廣泛用于工業(yè)自動(dòng)化、半導(dǎo)體制造和精密制造等領(lǐng)域。這些模塊通常負(fù)責(zé)管理和協(xié)調(diào)機(jī)器人或自動(dòng)化設(shè)備的各種子系統(tǒng)和傳感器,確保高效、穩(wěn)定的...

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Brooks BM23100L03/E PC23100微型處理器模塊

    Brooks BM23100L03/E PC23100微型處理器模塊 PDF資料

    1.產(chǎn) 品 資 料 介 紹:

    中文資料:

    Brooks BM23100L03/E 和 PC23100 微型處理器模塊是專為自動(dòng)化系統(tǒng)和機(jī)器人應(yīng)用設(shè)計(jì)的模塊,提供高效的數(shù)據(jù)處理能力和系統(tǒng)控制功能,廣泛用于工業(yè)自動(dòng)化、半導(dǎo)體制造和精密制造等領(lǐng)域。這些模塊通常負(fù)責(zé)管理和協(xié)調(diào)機(jī)器人或自動(dòng)化設(shè)備的各種子系統(tǒng)和傳感器,確保高效、穩(wěn)定的操作。

    主要特點(diǎn)

    • 高性能處理器: 采用先進(jìn)的微型處理器技術(shù),支持多任務(wù)并行處理,滿足復(fù)雜自動(dòng)化任務(wù)的需求。
    • 模塊化設(shè)計(jì): BM23100L03/E 和 PC23100 模塊設(shè)計(jì)緊湊,易于集成,適合不同的自動(dòng)化設(shè)備。
    • 多種接口支持: 提供豐富的接口選項(xiàng),可以連接各種外圍設(shè)備、傳感器和執(zhí)行器,便于系統(tǒng)集成。
    • 高可靠性: 專為工業(yè)應(yīng)用環(huán)境設(shè)計(jì),能夠在嚴(yán)苛的工作環(huán)境下穩(wěn)定運(yùn)行,適應(yīng)高溫、振動(dòng)等惡劣條件。
    • 靈活配置: 支持靈活的參數(shù)配置,適用于不同的應(yīng)用需求,如運(yùn)動(dòng)控制、數(shù)據(jù)采集和實(shí)時(shí)反饋等。

    應(yīng)用領(lǐng)域

    • 半導(dǎo)體制造: 在晶圓處理和傳輸設(shè)備中廣泛使用,確保高精度的控制和快速響應(yīng),以滿足半導(dǎo)體制造對精度和效率的嚴(yán)格要求。
    • 工業(yè)機(jī)器人: 作為機(jī)器人控制模塊,用于協(xié)調(diào)多軸運(yùn)動(dòng)和控制機(jī)械臂、自動(dòng)導(dǎo)引車(AGV)等,優(yōu)化生產(chǎn)線的自動(dòng)化操作。
    • 實(shí)驗(yàn)室自動(dòng)化:在需要精準(zhǔn)控制和數(shù)據(jù)采集的實(shí)驗(yàn)室環(huán)境中使用,支持樣品處理、分揀和運(yùn)輸?shù)炔僮鳌?/li>
    • 精密制造: 支持各種自動(dòng)化裝配、檢測和測試設(shè)備的控制需求,確保設(shè)備在生產(chǎn)過程中的高效穩(wěn)定運(yùn)行。

    技術(shù)規(guī)格概述(假設(shè)常見規(guī)格)

    • 電源需求: 通常為24V DC(具體電壓需根據(jù)型號確認(rèn))
    • 處理速度: 支持高頻處理,適合實(shí)時(shí)計(jì)算任務(wù)
    • 通信接口: 包含 RS-232、Ethernet 或其他工業(yè)通信接口
    • 溫度范圍: 0°C 至 50°C,適合工業(yè)環(huán)境
    • 尺寸: 緊湊的模塊化設(shè)計(jì),便于嵌入式應(yīng)用

    英文資料:

    The Brooks BM23100L03/E and PC23100 microprocessor modules are designed specifically for automation systems and robot applications, providing efficient data processing capabilities and system control functions. They are widely used in industrial automation, semiconductor manufacturing, precision manufacturing, and other fields. These modules are typically responsible for managing and coordinating various subsystems and sensors of robots or automation equipment, ensuring efficient and stable operation.

    main features 

    High performance processor: adopting advanced microprocessor technology, supporting multitasking parallel processing, and meeting the needs of complex automation tasks.

    Modular design: The BM23100L03/E and PC23100 modules are designed to be compact, easy to integrate, and suitable for different automation equipment.

    Multiple interface support: Provides rich interface options to connect various peripheral devices, sensors, and actuators, facilitating system integration.

    High reliability: Designed specifically for industrial application environments, it can operate stably in harsh working environments and adapt to harsh conditions such as high temperatures and vibrations.

    Flexible configuration: Supports flexible parameter configuration, suitable for different application requirements, such as motion control, data acquisition, and real-time feedback.

    application area 

    Semiconductor manufacturing: widely used in wafer processing and transmission equipment to ensure high-precision control and fast response, in order to meet the strict requirements of precision and efficiency in semiconductor manufacturing.

    Industrial robot: As a robot control module, it is used to coordinate multi axis motion and control robotic arms, automatic guided vehicles (AGVs), etc., optimizing the automation operation of production lines.

    Laboratory automation: used in laboratory environments that require precise control and data collection, supporting operations such as sample processing, sorting, and transportation.

    Precision manufacturing: supports the control requirements of various automated assembly, inspection, and testing equipment to ensure efficient and stable operation of the equipment during the production process.

    Technical specification overview (assuming common specifications)

    Power requirement: Usually 24V DC (specific voltage needs to be confirmed according to the model)

    Processing speed: Supports high-frequency processing, suitable for real-time computing tasks

    Communication interface: including RS-232, Ethernet, or other industrial communication interfaces

    Temperature range: 0 ° C to 50 ° C, suitable for industrial environments

    Size: Compact modular design for easy embedded applications

    2.產(chǎn)      品      展      示      

    e734b38e278742738fbb994caeed1b43_3-241113111G1440.jpg


    3.其他產(chǎn)品

    ASEA ES1211模塊板卡

    Asea SNAT-03驅(qū)動(dòng)控制板

    ASEA DSQC215機(jī)器人控制板

    4.其他英文產(chǎn)品

    ABB UN0803B-P Printed Circuit Board

    ABB UN0503a-P Digital Output Module

    GESAS CAN-DCM digital amplifier module

    5.更多庫存型號

    PMA43P-11100-00ANAT 0100-76091PFEA113
    PMA43P-10100-00AMAT 0100-00985PFTL 201D-100.0KN
    PMA43P-00100-00AMAT 0100-00156PFEA113-IP65 3BSE050092R65
    PMA43N-Y0100-02AMAT 0100-20097PFTL101AE
    PMA43N-11100-00AMAT 0100-00047PFTL 101B-10.0KN
    PMA43N-10100-00AMAT 0100-02167PFRL101C
    PMA43N-01100-00AMAT 0100-02131PFEA112
    PMA43N-00100-00AMAT 0100-00534PFTL101A-0.5 3BSE004160R1 0.5 

    本篇文章出自瑞昌明盛自動(dòng)化設(shè)備有限公司官網(wǎng),轉(zhuǎn)載請附上此鏈接:http://www.jiangxidcs.co

    品牌:Brooks


    型號:BM23100L03/E PC23100微型處理器模塊


    質(zhì)保:一年


    成色:全新/二手


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    特點(diǎn):主營產(chǎn)品各種模塊/卡件,控制器,觸摸屏,伺服驅(qū)動(dòng)器。


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