IS200VTURH2BAC燃機(jī)模塊
單個(gè)大功率 AC/DC 轉(zhuǎn)換器的運(yùn)行功率高于多個(gè)較小轉(zhuǎn)換器的運(yùn)行功率。盡管單個(gè)電源都盡可能保持較低的內(nèi)部功耗，但多個(gè)電源的內(nèi)部功耗仍會(huì)疊加起來(lái)。例如，如果一個(gè)設(shè)備機(jī)架裝了十二個(gè)獨(dú)立的 100W 電源，每個(gè)電源的內(nèi)部功耗為 2W，總損耗加起來(lái)為 24W。相較之下，一個(gè)大型轉(zhuǎn)換器的損耗僅 2W。如果齒輪托盤(pán)連續(xù)運(yùn)行，每年可節(jié)省約 200 kWh。RACM1200 的空載功耗為 0.75W（主輸出關(guān)閉，輔助輸出保持運(yùn)作），滿(mǎn)足「80 Plus Platinum」和「Ecodesign Lot 6」的效率要求。
IS200VTURH2BAC燃機(jī)模塊輸入電壓范圍為 85VAC 至 264VAC。RACM1200-V 提供 1000W 輸出功率，配備接觸式冷卻的金屬外殼，體積僅 102mm x 229mm x 40mm。輸出功率可達(dá)1200W并維持10秒以上。然而，若要 1200W 連續(xù)輸出就需要配備風(fēng)扇并確保有2.5m/s的空氣流動(dòng)。風(fēng)扇可由用戶(hù)控制，為此提供了一個(gè)可控的輔助輸出以進(jìn)行溫度管理。RACM1200-V的重要數(shù)據(jù)
輸出功率：40°C環(huán)境溫度和230V輸入電壓的輸出功率為1000W；使用風(fēng)扇或短峰值負(fù)載可達(dá)1200W。包含連接器的尺寸（長(zhǎng)x寬x高）：228.0mm x 96.2mm x 40.0mm; 其他供應(yīng)商產(chǎn)品的連接器會(huì)受到機(jī)械沖擊。輸入電壓：85V至264V
輸出電壓：
24V類(lèi)型可通過(guò)DIP開(kāi)關(guān)在100mV至28V的范圍內(nèi)進(jìn)行調(diào)節(jié)。
48V類(lèi)型可通過(guò)DIP開(kāi)關(guān)在200mV至56V的范圍內(nèi)進(jìn)行調(diào)節(jié)。
最大輸出電流：50A @ 24V、25A @ 48V。
主輸出和輔助電壓的保護(hù)功能：
-過(guò)載保護(hù)、自動(dòng)復(fù)位
-過(guò)電流和短路保護(hù)、自動(dòng)復(fù)位
-過(guò)熱保護(hù)、自動(dòng)重啟
溫度范圍：-40°C至80°C，50°C開(kāi)始降額；請(qǐng)?jiān)斠?jiàn)數(shù)據(jù)表
在40°C環(huán)境溫度下的使用壽命：88,000小時(shí)
最大輸出電壓紋波：輸出電壓的1%
輸出電壓容差：25%°C通常為1%，在更高的溫度下最多±2%
標(biāo)準(zhǔn)認(rèn)證：IEC/EN 62368、UL/IEC/EN 60601
符合IEC/EN 61558-2-16、IEC61010-1以及IEC62477-1 OVC II最高2000m
通過(guò)鋁基板或強(qiáng)制氣流進(jìn)行冷卻。
The minimum spacing of wires is mainly determined by the insulation resistance and breakdown voltage between wires in the worst case. For integrated circuits, especially digital circuits, as long as the technology allows, the spacing can be less than 0.1 ~ 0.2 mm.③ The bend of printed wire is generally circular arc, and the right angle or included angle will affect the electrical performance in high-frequency circuit. In addition, try to avoid using large-area copper foil, otherwise, copper foil expansion and falling off will easily occur when heated for a long time. When a large area of copper foil must be used, it is best to use a grid shape, which is conducive to eliminating the volatile gas generated by the heating of the adhesive between the copper foil and the substrate.
4. PadThe central hole of the pad is slightly larger than the diameter of the device lead. If the pad is too large, it is easy to form false soldering. The outer diameter D of the pad is generally not less than (d+1.2) mm, where D is the diameter of the lead. For high-density digital circuits, the minimum diameter of the pad can be (d+1.0) mm. Face recognition is a kind of biometric
