VMIVME-7648-740工控模塊機(jī)器人備件
還應(yīng)注意隨著溫度
增加約:因此必須允許一些保護(hù)帶應(yīng)用曲線圖與開（僅限）圖 關(guān)（僅限 ）電源建議和設(shè)計(jì)為在 至 的輸入電源電壓范圍內(nèi)工作輸入電源必須調(diào)節(jié)良好無雜散噪聲為確?；蜉敵鲭妷旱玫搅己谜{(diào)節(jié)輸入電源必須至少為 或 以較高者為準(zhǔn)要求引腳 范圍內(nèi)的最小計(jì)算器值為μ布局 布局和設(shè)備的動(dòng)態(tài)性能取決于的布局布局實(shí)踐對(duì)于典型來說是足夠的可能會(huì)降低或的負(fù)載調(diào)節(jié)噪聲或瞬態(tài)性能通過將和放置在與或者相同的側(cè)并且盡可能接近包裝和的接地連接必須返回到或 引腳使用盡可能寬和短的銅跡線必須避免使用長(zhǎng)跡線長(zhǎng)度窄跡線寬度或通孔連接這些附加的電感和電阻會(huì)導(dǎo)致較差的性能特別是在瞬態(tài)條件下強(qiáng)烈建議在兩層的相對(duì)側(cè)或嵌入多層中的接地平面該接地
平面用于兩個(gè)目的：
提供電路參考平面以確保準(zhǔn)確性以及提供熱平面以通過封裝下的熱通孔從或 封裝移除熱量 電源接地 熱 / 電源接地 熱 電源地 電源地線文件夾鏈接： 版權(quán)所有?–德克薩斯儀器公司提交文件反饋布局示例圖 軟件包圖 軟件包圖 軟件包圖 封裝 安裝（無回拉）引線封裝需要特定的安裝技術(shù)詳細(xì)信息見應(yīng)用報(bào)告無引線引線框架封裝參考節(jié)“設(shè)計(jì)建議”（第頁）應(yīng)注意的是應(yīng)與封裝一起使用的樣式是（非焊料掩模定義）類型此外建議端子比包裝長(zhǎng)以形成焊料圓角以提高可靠性和檢查輸入電流在兩個(gè)引腳和之間分流兩個(gè)插腳必須連接在一起以確保設(shè)備在額定電流下滿足所有規(guī)格封裝的熱分解與印刷電路板結(jié)構(gòu)和連接到的額外銅面積的數(shù)量直接相關(guān)封裝底部的（暴露）
It should also be noted that
Increase by about: Therefore, some protective tapes must be allowed to apply the curve graph and the on (only) graph. The power supply is recommended and designed to work within the input power voltage range of to. The input power supply must be well adjusted without stray noise to ensure or the output voltage is well adjusted. The input power supply must be at least or the higher one. The minimum calculator value within the pin range is μ The layout layout and the dynamic performance of the equipment depend on the layout layout practice, which is typical enough, and may reduce the load regulation noise or transient performance of or. By placing and on the same side as or and as close to the package and as possible, the grounding connection must be returned to or pins. Use copper traces as wide and short as possible. Avoid using long trace lines, narrow trace lines, or through hole connections. These additional inductors and resistors will conduct Poor performance, especially under transient conditions, it is strongly recommended that the grounding be conducted on the opposite side of two layers or on the grounding plane embedded in multiple layers
The plane is used for two purposes:
Provide a circuit reference plane to ensure accuracy and a thermal plane to remove thermal power from or from the package through the thermal vias under the package Geothermal/Power Ground Geothermal Power Ground Wire Folder Link: Copyright ?– Texas Instruments submitted a file feedback layout example diagram software package diagram software package diagram package installation (no pullback) lead packaging needs specific installation technology details see the application report No lead lead frame packaging reference section "Design recommendations" (page) It should be noted that the style that should be used with packaging is (non solder mask definition) Type In addition, it is recommended that the terminal be longer than the package to form a solder fillet to improve reliability and check that the input current is shunted between two pins. The two pins must be connected together to ensure that the equipment meets the thermal decomposition of all specifications of packages at rated current. The PCB structure and the number of additional copper areas connected to it are directly related to the (exposed)
