VMIVME-7648-540工控模塊卡件
通過導(dǎo)電管芯附著粘合劑
連接到管芯基板沒有直接電（線）連接到任何引腳管芯襯底和器件接地之間存在寄生結(jié)因此強(qiáng)烈建議直接連接到設(shè)備引線（例如）處的地或者可以保持浮動（即沒有電氣連接）但不建議這樣做不得連接至接地以外的任何電位 –年月–年月修訂產(chǎn)品文件夾鏈接： 提交文檔反饋版權(quán)所有?– /敏感性射頻干擾和電磁干擾會降低任何集成電路的性能因?yàn)槠骷?nèi)部的幾何尺寸較小在存在產(chǎn)生具有顯著高頻能量含量（>）的信號的電路源的應(yīng)用中必須小心確保這不會影響設(shè)備調(diào)節(jié)器如果調(diào)節(jié)器的輸入側(cè)存在/噪聲（例如輸入源來自開關(guān)調(diào)節(jié)器輸出的應(yīng)用）則必須在設(shè)備的引腳處使用良好的陶瓷旁路電容器如果負(fù)載連接到高速切換的設(shè)備輸出（如時(shí)鐘）則負(fù)載所需的高頻電流脈沖必須由設(shè)備輸出上的控制器提供由于調(diào)節(jié)器環(huán)路的帶寬小于控制電路不能響應(yīng)高于該頻率的負(fù)載變化這意味著設(shè)備在以上頻率下的有效輸出阻抗僅由
輸出計(jì)算器
確定在負(fù)載高速切換的應(yīng)用中設(shè)備的輸出可能需要與負(fù)載進(jìn)行隔離建議在輸出控制器和負(fù)載之間放置一些電感并將良好的旁路控制器直接放置在負(fù)載上布局在高噪聲環(huán)境中也至關(guān)重要因?yàn)?很容易直接輻射到跡線中在可能的情況下噪聲電路應(yīng)與清潔電路隔離并通過串聯(lián)接地在頻率下接地平面開始看起來是感應(yīng)的/會導(dǎo)致接地平面上的接地反彈在多層應(yīng)用中應(yīng)注意布局以便噪聲功率和接地平面不會直接輻射到承載模擬功率和接地面的相鄰層輸出噪聲噪聲以兩種方式指定：斑點(diǎn)噪聲或輸出噪聲密度是在特定頻率（以帶寬測量）下在調(diào)節(jié)器輸出處測量的所有噪聲源的總和這種類型的噪聲通常作為頻率的函數(shù)繪制在曲線上
Adhesion through conductive tube core
There is no direct electrical (wire) connection to the core substrate. There is a parasitic junction between the core substrate and the device grounding. Therefore, it is strongly recommended to directly connect to the ground at the device lead (for example) or keep it floating (that is, there is no electrical connection), but it is not recommended to do so. It is not recommended to connect to any potential other than the ground
Sensitive radio frequency interference and electromagnetic interference will reduce the performance of any integrated circuit because the internal geometric dimensions of the device are small. In applications where there is a circuit source that generates a signal with a significant high frequency energy content (>), care must be taken to ensure that this does not affect the device regulator if there is/noise on the input side of the regulator (such as applications where the input source is from the output of the switch regulator) Good ceramic bypass capacitors must be used at the device pins. If the load is connected to the high-speed switching device output (such as the clock), the high-frequency current pulse required by the load must be provided by the controller on the device output. Since the bandwidth of the regulator loop is less than that of the control circuit, it cannot respond to load changes higher than this frequency, which means that the effective output impedance of the device at the above frequencies is only
Output Calculator
It is recommended to place some inductance between the output controller and the load and place a good bypass controller directly on the load. It is also important to layout in a high noise environment because/it is easy to directly radiate into the trace. When possible, the noise circuit should be isolated from the clean circuit and grounded in series at the frequency It is inductive/will cause ground bounce on the ground plane. In multi-layer applications, attention should be paid to the layout so that the noise power and ground plane will not directly radiate to the adjacent layers carrying analog power and ground plane. The output noise noise is specified in two ways: speckle noise or output noise density is at a specific frequency (measured in bandwidth) The sum of all noise sources measured at the output of the regulator. This type of noise is usually plotted on the curve as a function of frequency
