VMIVME-5504工控模塊備件
典型特性除非另有說(shuō)明源漏二極管正向電壓閾值導(dǎo)通電阻與柵源電壓?jiǎn)蚊}沖電源安全工作區(qū)接頭至環(huán)境溫度 源極至漏極電壓 源極電流 μ 溫度 導(dǎo)通電阻柵極至源極電壓 功率時(shí)間 單脈沖 受限于開(kāi)啟*受限于 μ 漏極到源極電壓*>指定打開(kāi)時(shí)的最小 漏極電流 。 版本。 年月日文件編號(hào)：有關(guān)技術(shù)問(wèn)題請(qǐng)聯(lián)系：@本文件如有更改恕不另行通知。此處所述的產(chǎn)品和本文件受上規(guī)定的具體免責(zé)聲明的約束。典型特性除非另有說(shuō)明否則為電流降額和功率降額注。功率耗散基于最大值使用結(jié)到殼的熱阻在使用額外散熱的情況下更適用于確定耗散上限。當(dāng)該額定值低于封裝限制 外殼溫度 漏電流封裝限制 –外殼溫度功率 時(shí)用于確定電流額定值。
此處所述的產(chǎn)品
本文件受上規(guī)定的具體免責(zé)聲明的約束。典型特性除非另有說(shuō)明標(biāo)準(zhǔn)化熱瞬態(tài)阻抗接頭到環(huán)境標(biāo)準(zhǔn)化熱瞬變阻抗接頭至腳 保持全球制造能力。產(chǎn)品可在幾個(gè)合格地點(diǎn)之一生產(chǎn)。硅技術(shù)和封裝可靠性的可靠性數(shù)據(jù)代表所有合格位置的組合。有關(guān)包裝膠帶圖紙零件標(biāo)記和可靠性數(shù)據(jù)等相關(guān)文件請(qǐng)?jiān)L問(wèn) 方波脈沖持續(xù)時(shí)間歸一化有效瞬態(tài)熱阻抗 注釋：占空比每單位基礎(chǔ) 。表面安裝占空比單脈沖 占空比方波脈沖持續(xù)時(shí)間歸一化有效瞬態(tài)熱阻抗 單脈沖 包裝信息文件編號(hào) 座椅平面 量規(guī)平面座面
Typical characteristics Unless otherwise specified, source drain diode forward voltage threshold on resistance and grid source voltage Single pulse power supply Safe working area connector to ambient temperature Source to drain voltage Source current μ Temperature on resistance Grid to source voltage Power time Single pulse is limited to ON * Limited to μ Drain to source voltage *>Minimum drain current when specified to ON. edition. Document No.: For technical problems, please contact: @ This document is subject to change without notice. The products described herein and this document are subject to the specific disclaimers set forth above. Typical characteristics are current derating and power derating unless otherwise stated. Power dissipation is based on the maximum value. The use of junction to shell thermal resistance is more suitable for determining the upper dissipation limit when additional heat dissipation is used. This rating is used to determine the current rating when it is lower than the enclosure temperature leakage current enclosure limit enclosure temperature power.
Products described here
This document is subject to the specific disclaimers set forth above. Typical characteristics Standardized thermal transient impedance connector to environment Standardized thermal transient impedance connector to pin maintains global manufacturing capability unless otherwise specified. The product can be produced in one of several qualified locations. Reliability data for silicon technology and package reliability represent a combination of all qualified locations. For relevant documents such as packaging tape drawings, part marks and reliability data, please visit the normalized effective transient thermal impedance of square wave pulse duration note: duty cycle per unit basis. Surface mounting duty cycle Single pulse duty cycle Square wave pulse duration normalization Effective transient thermal impedance Single pulse packaging information File number Seat plane Gauges Plane seating surface
