RELIANCE 0-57C407遠(yuǎn)程頭輸入/輸出
3排最大70W低于70W1 5排最大90W低于90W1熱要求MVME7100模塊在55°C（131°F）環(huán)境溫度下運(yùn)行時(shí)，要求最小氣流為10 CFM，均勻分布在整個(gè)電路板上，氣流從散熱器流到PMC2現(xiàn)場(chǎng)。2.3.4顯熱部件下表總結(jié)了顯著溫升的部件。這些部件應(yīng)進(jìn)行監(jiān)測(cè)，以評(píng)估熱性能。該表還提供了部件參考代號(hào)和最大允許工作溫度。您可以通過(guò)參考代號(hào)在板上找到組件，如下一頁(yè)的圖2-1和圖2-2所示。未完全填充的電路板版本可能不包含這些組件。組件的首選測(cè)量位置可能是表中指定的連接點(diǎn)、外殼或環(huán)境。結(jié)溫是指由芯片上的熱裝置測(cè)量的溫度。外殼溫度是指部件頂部中心表面的溫度?？諝鉁囟仁侵覆考浇沫h(huán)境溫度。
3-Row 70W maximum Below 70W1 5-Row 90W maximum Below 90W1 Thermal Requirements The MVME7100 module requires a minimum air flow of 10 CFM uniformly distributed across the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a 55°C (131°F) ambient temperature. 2.3.4 Thermally Significant Components The following table summarizes components that exhibit significant temperature rises. These are the components that should be monitored to assess thermal performance. The table also supplies the component reference designator and the maximum allowable operating temperature. You can find components on the board by their reference designators as shown in Figure2- 1 and Figure2-2 on the next page. Versions of the board that are not fully populated may not contain some of these components.The preferred measurement location for a component may be junction, case, or ambient as specified in the table. Junction temperature refers to the temperature measured by an onchip thermal device. Case temperature refers to the temperature at the top, center surface of the component. Air temperature refers to the ambient temperature near the component.
