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BENTLY 3500/15電源模塊

作者:xqt 發(fā)布時(shí)間:2022-07-05 14:29:14 次瀏覽

BENTLY 3500/15電源模塊,3500/15使用進(jìn)展冷卻要求摩托羅拉VMEmodules的指定、設(shè)計(jì)和測試在進(jìn)風(fēng)溫度范圍為0的情況下可靠運(yùn)行攝氏度至55攝氏度(32華氏度至131華氏度)強(qiáng)制空氣冷卻。溫度鑒定在標(biāo)準(zhǔn)摩托羅拉VMEsystem-1000機(jī)箱。25瓦加載板插入兩個(gè)卡槽中,每側(cè)一個(gè),靠近測試板,以模擬高功率密度系統(tǒng)配置。三個(gè)軸流風(fēng)機(jī)的組件,額定功率為100每個(gè)風(fēng)扇的CFM直接放置

BENTLY 3500/15電源模塊,3500/15使用進(jìn)展

冷卻要求摩托羅拉VMEmodules的指定、設(shè)計(jì)和測試在進(jìn)風(fēng)溫度范圍為0的情況下可靠運(yùn)行攝氏度至55攝氏度(32華氏度至131華氏度)強(qiáng)制空氣冷卻。溫度鑒定在標(biāo)準(zhǔn)摩托羅拉VMEsystem-1000機(jī)箱。25瓦加載板插入兩個(gè)卡槽中,每側(cè)一個(gè),靠近測試板,以模擬高功率密度系統(tǒng)配置。三個(gè)軸流風(fēng)機(jī)的組件,額定功率為100每個(gè)風(fēng)扇的CFM直接放置在MVME卡固定框架下。

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BENTLY 3500/15電源模塊這個(gè)在風(fēng)扇組件之間測量進(jìn)氣溫度和卡籠,其中進(jìn)入的氣流首先遇到正在測試的模塊。測試軟件在模塊運(yùn)行時(shí)執(zhí)行受到環(huán)境溫度變化的影響。外殼溫度對關(guān)鍵的高功率密度集成電路進(jìn)行監(jiān)控確保不超過組件供應(yīng)商的規(guī)格。而冷卻所需的確切風(fēng)量取決于環(huán)境空氣溫度以及板和其他熱源,通常可以充分冷卻通過模塊上的10 CFM實(shí)現(xiàn)。空氣流量較小需要在溫度較低的環(huán)境中冷卻模塊最大環(huán)境。在更有利的熱條件下可以在高于55%的溫度下可靠地操作模塊攝氏度,空氣流量增加。值得注意的是除了空氣動(dòng)力裝置的額定CFM外,還有幾個(gè)因素,這決定了流過模塊的實(shí)際空氣體積。通訊委員會規(guī)章MVME147在符合FCC的底盤上進(jìn)行了測試,符合A類設(shè)備的要求。FCC合規(guī)性在以下條件下實(shí)現(xiàn):所有外部輸入/輸出端口上的屏蔽電纜。2、通過金屬外殼連接至接地的電纜屏蔽連接至導(dǎo)電模塊前面板的連接器。

Cooling Requirements Motorola VMEmodules are specified, designed, and tested to operate reliably with an incoming air temperature range from 0 degrees C to 55 degrees C (32 degrees F to 131 degrees F) with forced air cooling. Temperature qualification is performed in a standard Motorola VMEsystem- 1000 chassis. Twenty-five watt load boards are inserted in the two card slots, one on each side, adjacent to the board under test to simulate a high power density system configuration. An assembly of three axial fans, rated at 100 CFM per fan, is placed directly under the MVME card cage. The incoming air temperature is measured between the fan assembly and the card cage where the incoming airstream first encounters the module under test. Test software is executed as the module is subjected to ambient temperature variations. Case temperatures of critical, high power density integrated circuits are monitored to ensure component vendors specifications are not exceeded. While the exact amount of airflow required for cooling depends on the ambient air temperature and the type, number, and location of boards and other heat sources, adequate cooling can usually be achieved with 10 CFM flowing over the module. Less air flow is required to cool the module in environments having lower maximum ambients. Under more favorable thermal conditions it may be possible to operate the module reliably at higher than 55 degrees C with increased air flow. It is important to note that there are several factors, in addition to the rated CFM of the air mover, which determine the actual volume of air flowing over a module. FCC Compliance The MVME147 was tested in an FCC-compliant chassis, and meets the requirements for Class A equipment. FCC compliance was achieved under the following conditions: 1. Shielded cables on all external I/O ports. 2. Cable shields connected to earth ground via metal shell connectors bonded to a conductive module front panel.

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