FLN4234A模塊，MOTOROLA中文說明
兩個三排96針DIN型連接器P1和P2為基板和VMEbus之間的接口。P1提供電源和用于24位尋址和16位數(shù)據(jù)的VME信號。其引腳分配為由IEEE P1014-1987 VMEbus規(guī)范設(shè)置。P2 B行電源帶電源的基板，上面有8條VMEbus地址線，以及具有額外的16條VMEbus數(shù)據(jù)線。P2行A和C不用于MVME172LX實現(xiàn)。
FLN4234A模塊P1和P2的引腳分配為表5-8和表5-9分別列出了電路板規(guī)格下表列出了MVME172LX的一般規(guī)格VME嵌入式控制器。后續(xù)章節(jié)詳細介紹了冷卻要求和EMC法規(guī)遵從性。MVME172LX板的完整功能描述見第4章。可選IndustryPack模塊的規(guī)格可以是可在這些模塊的文檔中找到。冷卻要求指定了摩托羅拉MVME172LX VME嵌入式控制器，經(jīng)過設(shè)計和測試，可在進氣溫度下可靠運行范圍為0°至55°C（32°至131°F），整個系統(tǒng)強制風(fēng)冷組裝（基板和模塊）的速度通?？梢酝ㄟ^以下方式實現(xiàn)：使用100 CFM軸流風(fēng)機。溫度鑒定在標(biāo)準(zhǔn)摩托羅拉VME系統(tǒng)機箱。25瓦負荷板插入兩個卡槽中，每側(cè)一個，與下面的板相鄰測試，以模擬高功率密度系統(tǒng)配置。大會三個軸流風(fēng)機中，每個風(fēng)機的額定功率為100 CFM，直接放置在VME卡固定框架。進氣溫度是在風(fēng)機組件和卡籠，其中首先進入氣流遇到被測模塊。測試軟件作為模塊執(zhí)行受到環(huán)境溫度變化的影響。外殼溫度監(jiān)控關(guān)鍵的高功率密度集成電路，以確保未超過組件供應(yīng)商的規(guī)格。而冷卻所需的確切風(fēng)量取決于環(huán)境空氣溫度和電路板的類型、數(shù)量和位置，以及對于其他熱源，通?？梢允褂?0 CFM實現(xiàn)充分冷卻490線性調(diào)頻流過模塊。需要更少的氣流來冷卻具有較低最大環(huán)境的環(huán)境中的模塊。在“更多”下良好的熱條件下，可以操作模塊在高于55°C且氣流增加的情況下可靠運行。值得注意的是除了空氣動力裝置的額定CFM外，還有幾個因素，這決定了空氣流過管道的實際體積和速度單元
Two three-row 96-pin DIN type connectors, P1 and P2, supply the
interface between the base board and the VMEbus. P1 provides power and
VME signals for 24-bit addressing and 16-bit data. Its pin assignments are
set by the IEEE P1014-1987 VMEbus Specification. P2 Row B supplies
the base board with power, with the upper 8 VMEbus address lines, and
with an additional 16 VMEbus data lines. P2 rows A and C are not used in
the MVME172LX implementation. The pin assignments for P1and P2 are
listed in Table 5-8 and Table 5-9 respectivelyBoard Specifications
The following table lists the general specifications for the MVME172LX
VME embedded controller. The subsequent sections detail cooling
requirements and EMC regulatory compliance.
A complete functional description of the MVME172LX boards appears in
Chapter 4. Specifications for the optional IndustryPack modules can be
found in the documentation for those modules. Cooling Requirements
The Motorola MVME172LX VME Embedded Controller is specified,
designed, and tested to operate reliably with an incoming air temperature
range from 0° to 55° C (32° to 131° F) with forced air cooling of the entire
assembly (base board and modules) at a velocity typically achievable by
using a 100 CFM axial fan. Temperature qualification is performed in a
standard Motorola VME system chassis. Twenty-five-watt load boards are
inserted in two card slots, one on each side, adjacent to the board under
test, to simulate a high power density system configuration. An assembly
of three axial fans, rated at 100 CFM per fan, is placed directly under the
VME card cage. The incoming air temperature is measured between the
fan assembly and the card cage, where the incoming airstream first
encounters the module under test. Test software is executed as the module
is subjected to ambient temperature variations. Case temperatures of
critical, high power density integrated circuits are monitored to ensure that
component vendors’ specifications are not exceeded.
While the exact amount of airflow required for cooling depends on the
ambient air temperature and the type, number, and location of boards and
other heat sources, adequate cooling can usually be achieved with 10 CFM
and 490 LFM flowing over the module. Less airflow is required to cool the
module in environments having lower maximum ambients. Under more
favorable thermal conditions, it may be possible to operate the module
reliably at higher than 55° C with increased airflow. It is important to note
that there are several factors, in addition to the rated CFM of the air mover,
which determine the actual volume and speed of air flowing over a
module.
